On the Crack and Delamination Risk Optimization of a Si-Interposer for LED Packaging | Apr 15, 2013 - Publications - EnLight project

Energy efficient and intelligent lighting systems

On the Crack and Delamination Risk Optimization of a Si-Interposer for LED Packaging

Apr 15, 2013

Auersperg, J., Dudek, R., Jordan, R., Bochow-Neß, O., Rzepka, S., Michel, B., 14th Int. Conf. EuroSimE 2013, Wroclaw, Poland

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